Halo Industries develops laser-based wafering technology for silicon carbide (SiC) substrates, a critical material in semiconductor manufacturing. Founded in 2014 as a Stanford University spinout, the company has created a proprietary laser-controlled process that replaces mechanical wire-saw slicing, the dominant method for decades. The technology produces 2.2–2.3 wafers per millimeter while reducing kerf loss by 90%, addressing a manufacturing inefficiency that the industry estimates wastes billions of dollars annually in high-value materials.
SiC substrates are essential components in power electronics for electric vehicles, data centres, renewable energy systems, and aerospace applications. Halo's process improves both material yield and substrate quality, creating value across these verticals by lowering material costs and enabling better device performance. The company is currently scaling manufacturing operations to meet growing demand in these markets.
Halo has raised $132m in total funding, including an $80m Series B round led by the US Innovative Technology Fund. The company is focused on advancing semiconductor manufacturing through process innovation and scaling its proprietary technology to serve global customers in power electronics and related industries.
