Kulicke & Soffa, founded in 1951, develops and manufactures advanced equipment used in the assembly and packaging of semiconductors. The company's core technical domains are semiconductor assembly technology and advanced packaging systems. Its product portfolio includes ball bonders, wedge bonders, wafer-level bonders, and advanced packaging systems, alongside a range of consumables such as capillaries, dicing blades, and wedge bonding tools. The company also offers repair and refurbishment services through its K&S Care program.
The company's equipment serves the production needs of several key industry verticals, including automotive, compute, industrial, memory, and communications. Its advanced packaging systems are designed to enable the production of next-generation electronic devices. Kulicke & Soffa maintains a global operational footprint with a presence in Singapore, China, the United States, Germany, Israel, and the Netherlands.
