Founded in 1992, QP Technologies is a provider of microelectronic packaging and assembly, wafer preparation, and substrate design and development services. The company operates from a 20,000-square-foot facility in Escondido, California. Its technical work spans microelectronic packaging, assembly, wafer preparation, substrate design, and IC packaging technologies.
The company's offerings include over-molded QFN/DFN packages, pre-molded air-cavity QFN packages, and custom substrate solutions. These products and services serve a range of industry verticals, including automotive, aerospace, mil-aero, medical, industrial, and commercial sectors, as well as power and compound semiconductors.
QP Technologies holds ISO 9001:2015, ISO 13485:2016, and AS9100D certifications, and is ITAR registered.
